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NAC2122-Hxx

NAC2122-Hxx

Products in this category
  • NAC2121-Hxx
  • NAC2122-Hxx
  • NAC2123-Hxx
  • NAC2124-Hxx
  • NAC2125-Hxx

Noliac ring stack actuator NAC2122-Hxx (height in mm – Hxx) is based on the multilayer actuator NAC2122 and can be stacked to match you requirements. The standard range of NAC2122-Hxx is produced in a height between 4-80 mm. The ring stack provides a stroke in a range between 3.3 and 128.7 µm and blocking force up to 1810 N depending on the height of the stack.

Specifications Drawings Mount and connect Wires
Specifications
Attributes
Value
Tolerance
Length / outer diameter
8 mm
+0.45/-0.25 mm
Width / inner diameter
3 mm
+0.10/-0.30 mm
Max width / outer diameter max
9.8 mm
Height
4 — 80 mm
+/-0.2 mm or 1% (whichever is largest)
Operating voltage, max.
200 V
Free stroke, max.
3.3 — 128.7 µm
+/- 15%
Blocking force, max.
1810 N
+/-20%
Capacitance
180-7020 nF
+/- 15%
Stiffness
548-14 N/µm
+/-20%
Maximum operating temperature
150 °C
Material
Unloaded resonance frequency
>248k -14k Hz
Electrodes
Screen-printed Ag and soldered bus wire (option: glued connections)
Remarks
-

Stack options

Height
Stroke
Capacitance
Height
4 mm
Stroke
3.3 µm
Capacitance
180 nF
Height
6 mm
Stroke
6.6 µm
Capacitance
360 nF
Height
8 mm
Stroke
9.9 µm
Capacitance
540 nF
Height
10 mm
Stroke
13.2 µm
Capacitance
720 nF
Height
12 mm
Stroke
16.5 µm
Capacitance
900 nF
Height
14 mm
Stroke
19.8 µm
Capacitance
1080 nF
Height
16 mm
Stroke
23.1 µm
Capacitance
1260 nF
Height
18 mm
Stroke
26.4 µm
Capacitance
1440 nF
Height
20 mm
Stroke
29.7 µm
Capacitance
1620 nF
Height
22 mm
Stroke
33 µm
Capacitance
1800 nF
Height
24 mm
Stroke
36.3 µm
Capacitance
1980 nF
Height
26 mm
Stroke
39.6 µm
Capacitance
2160 nF
Height
28 mm
Stroke
42.9 µm
Capacitance
2340 nF
Height
30 mm
Stroke
46.2 µm
Capacitance
2520 nF
Height
32 mm
Stroke
49.5 µm
Capacitance
2700 nF
Height
34 mm
Stroke
52.8 µm
Capacitance
2880 nF
Height
36 mm
Stroke
56.1 µm
Capacitance
3060 nF
Height
38 mm
Stroke
59.4 µm
Capacitance
3240 nF
Height
40 mm
Stroke
62.7 µm
Capacitance
3420 nF
Height
42 mm
Stroke
66 µm
Capacitance
3600 nF
Height
44 mm
Stroke
69.3 µm
Capacitance
3780 nF
Height
46 mm
Stroke
72.6 µm
Capacitance
3960 nF
Height
48 mm
Stroke
75.9 µm
Capacitance
4140 nF
Height
50 mm
Stroke
79.2 µm
Capacitance
4320 nF
Height
52 mm
Stroke
82.5 µm
Capacitance
4500 nF
Height
54 mm
Stroke
85.8 µm
Capacitance
4680 nF
Height
56 mm
Stroke
89.1 µm
Capacitance
4860 nF
Height
58 mm
Stroke
92.4 µm
Capacitance
5040 nF
Height
60 mm
Stroke
95.7 µm
Capacitance
5220 nF
Height
62 mm
Stroke
99 µm
Capacitance
5400 nF
Height
64 mm
Stroke
102.3 µm
Capacitance
5580 nF
Height
66 mm
Stroke
105.6 µm
Capacitance
5760 nF
Height
68 mm
Stroke
108.9 µm
Capacitance
5940 nF
Height
70 mm
Stroke
112.2 µm
Capacitance
6120 nF
Height
72 mm
Stroke
115.5 µm
Capacitance
6300 nF
Height
74 mm
Stroke
118.8 µm
Capacitance
6480 nF
Height
76 mm
Stroke
122.1 µm
Capacitance
6660 nF
Height
78 mm
Stroke
125.4 µm
Capacitance
6840 nF
Height
80 mm
Stroke
128.7 µm
Capacitance
7020 nF
Drawings
Noliac - Your Piezo Partner
Mount and connect

Mounting
The actuators are usually grinded on top and bottom surfaces (perpendicular to the direction of expansion) in order to obtain flat and parallel surfaces for mounting. The actuators may be mounted either by mechanical clamping or gluing.

Avoiding short circuit can either be achieved by: 

  • Adding Kapton foil on the metallic surfaces.
  • Having inactive ceramic plates between the actuator and the metal plate.

Stacked actuators are manufactured with top and bottom insulating ceramic end-plates.

If glued, it is important to ensure a very thin glue line between the actuator and the substrate. It is recommended that a pressure, e.g. 2-5 MPa, is applied during the curing process.

To avoid significant loss of performance, the mounting of the actuators should avoid mechanical clamping and/or gluing on the sides of the actuator.

During manufacturing or handling, minor chips on the end-plates can appear. Minor chips cannot be avoided, but such chips do not affect performance.

Electrical connection

External electrodes

The external electrodes are screen printed silver as standard. Other materials, e.g. gold or silver/palladium are available on request. The positive electrode is indicated by a black spot.

Electrical connection to the external electrodes can be achieved by mechanical contacts, soldering, gluing with electrically conductive glues or wire bonding.

Mechanical connections

Mechanical connections can be arranged by e.g. copper springs contacted to the external electrodes. It is recommended to use external electrodes of gold in order to eliminate oxidation of the electrodes.

Soldering

Soldering electrical wires to the screen-printed silver electrode makes an excellent and time-stable connection. In order to avoid challenges with wetting the solder on the silver surface, always clean the external electrodes with a glass brush or steel wool.

Noliac - Your Piezo Partner

The actuators may only be stressed axially. Tilting and shearing forces must be avoided.

Noliac - Your Piezo Partner

The actuators without preload are sensitive to pulling forces. It is recommended to apply a pre-load in order to optimize the performances of the actuators.

Noliac - Your Piezo Partner

For linear actuators it is recommended not to use a metal plate on top and bottom in order to avoid short circuit.

Noliac - Your Piezo Partner

The force must be applied on the full surface of the actuator in order to assure a good load distribution.

Noliac - Your Piezo Partner

Epoxy glues are well suited for gluing piezoceramics.

Wires

When you order actuators from Noliac, you can have wires fitted to save time and money. However, you should consider these parameters, when you select a wire for connection: 

  • Operation voltage
  • Intensity of current
  • Operating temperature
  • Environment for example vacuum

We recommend Teflon wires
Teflon wires can stand temperatures above 200 ºC, whereas PVC wires only resist temperatures up to 80 ºC. In tough operating conditions or in vacuum, it is recommended always to use Teflon isolated wire to guarantee the proper performance of PZT-elements.

Wire thickness (AWG)
The wire thickness (AWG) is determined by the current that has to be transmitted to and from the PZT-element. The required current is determined by the capacitance of the PZT-element, the maximum driving frequency and the maximum voltage Up-p.

Noliac - Your Piezo Partner
Noliac - Your Piezo Partner

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Value
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Min
Min free stroke / µm
Min
Min estimated blocking force / N
Min
Min
Max
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Min
Max
Width or inner diameter / mm
Min
Max
Max height / mm
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